The principles for designing a high quality, manufactural flexible printed board are as follows (Minco Application Aid 24):
1) First, it is desirable to have some valuable literature aimed at applied research. The most useful document is the IPC standard or the MIL standard. For example, IPC-6013 and IPC-2223 or MIL-P-50884 can be used if the circuit is intended for military / aerospace applications.
2) According to the footprint in the circuits to determine the circuit parameters, which is helpful to cut out a practical paper circuit. By bending and molding the template experiment, you can achieve the highest efficiency. Designing the largest circuit network allows a panel to contain as many circuits as possible.
3) Determine the wiring location and the path of the wire, which will determine the number of conductor layers. The cost of the circuit usually increases as the number of layers increases. For example, two two-layer circuits may be cheaper than a four-layer flexible circuit (multilayer flexible pcb).
4) Calculating the wire width and spacing according to the current carrying capacity and voltage.
5) Determine to use which kind of material.
6) Select the method of wire termination and the dimensions of the vias. Methods for evaluating bend area and wire termination are required to determine if stiffeners are required.
7) Abandon the test method. Avoid to use the components beyond the normal specifications and to reduce costs.