• What kind of raw material do you use?
We use Polyimide, PEN or polyester material which depends on product operating temperature.

Raw material with or without adhesive?
Both are available, for higher reliability applications.

•Do you produce single-sided Flexible PCB with OSP surface treatment?
Yes, OSP surface treatment is available in Treefpc, while it is the same cost as immersion gold, so we suggest Immersion gold (ENIG) because it brings in better quality.

• Do you use Coverlay soldermask or photosensitive soldermask or UV soldermask or thermal ink soldermask?
For dynamic applications and according to the environment.

•Is your FPC available for Static or dynamic application?
Will impact the copper structure and raw material choice

Production “roll to roll “fully automatic or “panel to panel “?
Both are available.

• With shielding layers, stiffeners, components/connectors mounting, with peelable adhesive?
Yes, depends on customers’ requests.

• HDI with fine tracks
Yes, with laser holes.